Kapasitas papan kaku | |
Jumlah lapisan: | 1-42 lapisan |
Bahan: | FR4\high TG FR4\Material bebas timah\CEM1\CEM3\Aluminium\Metal core\PTFE\Rogers |
Out layer Cu ketebalan: | 1-6OZ |
Ketebalan lapisan Cu: | 1-4OZ |
Area pangolahan maksimum: | 610 * 1100 mm |
Ketebalan papan minimal: | 2 lapisan 0.3mm (12mil) |
4 lapisan 0.4mm (16mil) | |
6 lapisan 0.8mm (32mil) | |
8 lapisan 1.0mm (40mil) | |
10 lapisan 1.1mm (44mil) | |
12 lapisan 1.3mm (52mil) | |
14 lapisan 1.5mm (59mil) | |
16 lapisan 1.6mm (63mil) | |
Jembar minimal: | 0,076 mm (3 mil) |
Spasi Minimal: | 0,076 mm (3 mil) |
Ukuran bolongan minimal (bolongan pungkasan): | 0,2 mm |
Rasio aspek: | 10:01 |
Ukuran lubang bor: | 0,2-0,65 mm |
Toleransi pengeboran: | +\-0.05mm(2mil) |
Toleransi PTH: | Φ0.2-1.6mm +\-0.075mm (3mil) |
Φ1.6-6.3mm+\-0.1mm(4mil) | |
Toleransi NPTH: | Φ0.2-1.6mm +\-0.05mm(2mil) |
Φ1.6-6.3mm+\-0.05mm(2mil) | |
Toleransi Papan Rampung: | Ketebalan <0.8mm, Toleransi: +/-0.08mm |
0.8mm≤Thickness≤6.5mm, Toleransi +/-10% | |
Minimal jembatan soldermask: | 0,076 mm (3 mil) |
Twisting lan mlengkung: | ≤0,75% Min0,5% |
Raneg saka TG: | 130-215 ℃ |
Toleransi impedansi: | +/-10%, Min+/-5% |
Perawatan lumahing: | HASL, LF HASL |
Immersion Gold, Flash Emas, driji Emas | |
Immersion Silver, Immersion Tin, OSP | |
Plating Emas Selektif, ketebalan emas nganti 3um (120u") | |
Carbon Print, Peelable S/M, ENEPIG | |
Kapasitas papan aluminium | |
Jumlah lapisan: | Lapisan tunggal, lapisan kaping pindho |
Ukuran papan maksimal: | 1500 * 600 mm |
Ketebalan papan: | 0,5-3,0 mm |
Ketebalan tembaga: | 0,5-4oz |
Ukuran bolongan minimal: | 0,8 mm |
Jembar minimal: | 0,1 mm |
Spasi minimal: | 0,12 mm |
Ukuran pad minimal: | 10 mikron |
Rampung lumahing: | HASL, OSP, ENIG |
Wujud: | CNC, Punching, V-cut |
peralatan: | Tester Universal |
Flying Probe Open / Short Tester | |
Mikroskop daya dhuwur | |
Kit Testing Solderability | |
Peel Strength tester | |
High Volt Open & Short tester | |
Cross Section Molding Kit Kanthi Polisher | |
Kapasitas FPC | |
Lapisan: | 1-8 lapisan |
Ketebalan papan: | 0,05-0,5 mm |
Ketebalan tembaga: | 0,5-3 OZ |
Jembar minimal: | 0,075 mm |
Spasi minimal: | 0,075 mm |
Ukuran lubang in-through: | 0,2 mm |
Ukuran lubang laser minimum: | 0,075 mm |
Ukuran punching hole minimal: | 0,5 mm |
Toleransi Soldermask: | +\-0,5 mm |
Toleransi ukuran routing minimal: | +\-0,5 mm |
Rampung lumahing: | HASL, LF HASL, Immersion Silver, Immersion Gold, Flash Gold, OSP |
Wujud: | Punching, Laser, Cut |
peralatan: | Tester Universal |
Flying Probe Open / Short Tester | |
Mikroskop daya dhuwur | |
Kit Testing Solderability | |
Peel Strength tester | |
High Volt Open & Short tester | |
Cross Section Molding Kit Kanthi Polisher | |
Kapasitas kaku & fleksibel | |
Lapisan: | 1-28 lapisan |
Tipe bahan: | FR-4(Tg Dhuwur, Bebas Halogen, Frekuensi Dhuwur) |
PTFE, BT, Getek, Aluminium base,Tembaga dasar,KB, Nanya, Shengyi, ITEQ, ILM, Isola, Nelco, Rogers, Arlon | |
Ketebalan papan: | 6-240mil / 0,15-6,0mm |
Ketebalan tembaga: | 210um (6oz) kanggo lapisan njero 210um (6oz) kanggo lapisan njaba |
Min ukuran bor mekanik: | 0.2mm / 0.08" |
Rasio aspek: | 2:01 |
Ukuran panel maks: | Sigle sisih utawa pindho sisih: 500mm * 1200mm |
Lapisan multilayer: 508mm X 610mm (20″ X 24″) | |
Jembar garis / spasi min: | 0.076mm / 0.076mm (0.003″ / 0.003″)/ 3mil/3mil |
Via jinis bolongan: | Buta / Dikubur / Dipasang (VOP, VIP…) |
HDI / Mikrovia: | YA |
Rampung lumahing: | HASL, LF HASL |
Immersion Gold, Flash Emas, driji Emas | |
Immersion Silver, Immersion Tin, OSP | |
Plating Emas Selektif, ketebalan emas nganti 3um (120u") | |
Carbon Print, Peelable S/M, ENEPIG | |
Wujud: | CNC, Punching, V-cut |
peralatan: | Tester Universal |
Flying Probe Open / Short Tester | |
Mikroskop daya dhuwur | |
Kit Testing Solderability | |
Peel Strength tester | |
High Volt Open & Short tester | |
Cross Section Molding Kit Kanthi Polisher |
Wektu kirim: Sep-05-2022