page_banner

manfactyre

Kapasitas papan kaku
Jumlah lapisan: 1-42 lapisan
Bahan: FR4\high TG FR4\Material bebas timah\CEM1\CEM3\Aluminium\Metal core\PTFE\Rogers
Out layer Cu ketebalan: 1-6OZ
Ketebalan lapisan Cu: 1-4OZ
Area pangolahan maksimum: 610 * 1100 mm
Ketebalan papan minimal: 2 lapisan 0.3mm (12mil)
4 lapisan 0.4mm (16mil)
6 lapisan 0.8mm (32mil)
8 lapisan 1.0mm (40mil)
10 lapisan 1.1mm (44mil)
12 lapisan 1.3mm (52mil)
14 lapisan 1.5mm (59mil)
16 lapisan 1.6mm (63mil)
Jembar minimal: 0,076 mm (3 mil)
Spasi Minimal: 0,076 mm (3 mil)
Ukuran bolongan minimal (bolongan pungkasan): 0,2 mm
Rasio aspek: 10:01
Ukuran lubang bor: 0,2-0,65 mm
Toleransi pengeboran: +\-0.05mm(2mil)
Toleransi PTH: Φ0.2-1.6mm +\-0.075mm (3mil)
Φ1.6-6.3mm+\-0.1mm(4mil)
Toleransi NPTH: Φ0.2-1.6mm +\-0.05mm(2mil)
Φ1.6-6.3mm+\-0.05mm(2mil)
Toleransi Papan Rampung: Ketebalan <0.8mm, Toleransi: +/-0.08mm
0.8mm≤Thickness≤6.5mm, Toleransi +/-10%
Minimal jembatan soldermask: 0,076 mm (3 mil)
Twisting lan mlengkung: ≤0,75% Min0,5%
Raneg saka TG: 130-215 ℃
Toleransi impedansi: +/-10%, Min+/-5%
Perawatan lumahing: HASL, LF HASL
     Immersion Gold, Flash Emas, driji Emas
Immersion Silver, Immersion Tin, OSP
Plating Emas Selektif, ketebalan emas nganti 3um (120u")
Carbon Print, Peelable S/M, ENEPIG
Kapasitas papan aluminium
Jumlah lapisan: Lapisan tunggal, lapisan kaping pindho
Ukuran papan maksimal: 1500 * 600 mm
Ketebalan papan: 0,5-3,0 mm
Ketebalan tembaga: 0,5-4oz
Ukuran bolongan minimal: 0,8 mm
Jembar minimal: 0,1 mm
Spasi minimal: 0,12 mm
Ukuran pad minimal: 10 mikron
Rampung lumahing: HASL, OSP, ENIG
Wujud: CNC, Punching, V-cut
peralatan: Tester Universal
Flying Probe Open / Short Tester
Mikroskop daya dhuwur
Kit Testing Solderability
Peel Strength tester
High Volt Open & Short tester
Cross Section Molding Kit Kanthi Polisher
Kapasitas FPC
Lapisan: 1-8 lapisan
Ketebalan papan: 0,05-0,5 mm
Ketebalan tembaga: 0,5-3 OZ
Jembar minimal: 0,075 mm
Spasi minimal: 0,075 mm
Ukuran lubang in-through: 0,2 mm
Ukuran lubang laser minimum: 0,075 mm
Ukuran punching hole minimal: 0,5 mm
Toleransi Soldermask: +\-0,5 mm
Toleransi ukuran routing minimal: +\-0,5 mm
Rampung lumahing: HASL, LF HASL, Immersion Silver, Immersion Gold, Flash Gold, OSP
Wujud: Punching, Laser, Cut
peralatan: Tester Universal
Flying Probe Open / Short Tester
Mikroskop daya dhuwur
Kit Testing Solderability
Peel Strength tester
High Volt Open & Short tester
Cross Section Molding Kit Kanthi Polisher
Kapasitas kaku & fleksibel
Lapisan: 1-28 lapisan
Tipe bahan: FR-4(Tg Dhuwur, Bebas Halogen, Frekuensi Dhuwur)
PTFE, BT, Getek, Aluminium base,Tembaga dasar,KB, Nanya, Shengyi, ITEQ, ILM, Isola, Nelco, Rogers, Arlon
Ketebalan papan: 6-240mil / 0,15-6,0mm
Ketebalan tembaga: 210um (6oz) kanggo lapisan njero 210um (6oz) kanggo lapisan njaba
Min ukuran bor mekanik: 0.2mm / 0.08"
Rasio aspek: 2:01
Ukuran panel maks: Sigle sisih utawa pindho sisih: 500mm * 1200mm
Lapisan multilayer: 508mm X 610mm (20″ X 24″)
Jembar garis / spasi min: 0.076mm / 0.076mm (0.003″ / 0.003″)/ 3mil/3mil
Via jinis bolongan: Buta / Dikubur / Dipasang (VOP, VIP…)
HDI / Mikrovia: YA
Rampung lumahing: HASL, LF HASL
Immersion Gold, Flash Emas, driji Emas
Immersion Silver, Immersion Tin, OSP
Plating Emas Selektif, ketebalan emas nganti 3um (120u")
Carbon Print, Peelable S/M, ENEPIG
Wujud: CNC, Punching, V-cut
peralatan: Tester Universal
Flying Probe Open / Short Tester
Mikroskop daya dhuwur
Kit Testing Solderability
Peel Strength tester
High Volt Open & Short tester
Cross Section Molding Kit Kanthi Polisher

 


Wektu kirim: Sep-05-2022