Kapasitas Pangiriman
| Kapasitas papan kaku | |
| Jumlah lapisan: | 1-42 lapisan |
| Bahan: | FR4\high TG FR4\Material bebas timah\CEM1\CEM3\Aluminium\Metal core\PTFE\Rogers |
| Out layer Cu ketebalan: | 1-6OZ |
| Ketebalan lapisan Cu: | 1-4OZ |
| Area pangolahan maksimum: | 610 * 1100 mm |
| Ketebalan papan minimal: | 2 lapisan 0.3mm (12mil) 4 lapisan 0.4mm (16mil) 6 lapisan 0.8mm (32mil) 8 lapisan 1.0mm (40mil) 10 lapisan 1.1mm (44mil) 12 lapisan 1.3mm (52mil) 14 lapisan 1.5mm (59mil) 16 lapisan 1.6mm (63mil) |
| Jembar minimal: | 0,076 mm (3 mil) |
| Spasi Minimal: | 0,076 mm (3 mil) |
| Ukuran bolongan minimal (bolongan pungkasan): | 0,2 mm |
| Rasio aspek: | 10:1 |
| Ukuran lubang bor: | 0,2-0,65 mm |
| Toleransi pengeboran: | +\-0.05mm(2mil) |
| Toleransi PTH: | Φ0.2-1.6mm +\-0.075mm (3mil) Φ1.6-6.3mm+\-0.1mm(4mil) |
| Toleransi NPTH: | Φ0.2-1.6mm +\-0.05mm(2mil) Φ1.6-6.3mm+\-0.05mm(2mil) |
| Toleransi Papan Rampung: | Ketebalan <0.8mm, Toleransi: +/-0.08mm |
| 0.8mm≤Thickness≤6.5mm, Toleransi +/-10% | |
| Minimal jembatan soldermask: | 0,076 mm (3 mil) |
| Twisting lan mlengkung: | ≤0,75% Min0,5% |
| Raneg saka TG: | 130-215 ℃ |
| Toleransi impedansi: | +/-10%, Min+/-5% |
| Perawatan lumahing:
| HASL, LF HASL |
| Immersion Gold, Flash Emas, driji Emas | |
| Immersion Silver, Immersion Tin, OSP | |
| Plating Emas Selektif, ketebalan emas nganti 3um (120u") | |
| Carbon Print, Peelable S/M, ENEPIG | |
| Kapasitas papan aluminium | |
| Jumlah lapisan: | Lapisan tunggal, lapisan kaping pindho |
| Ukuran papan maksimal: | 1500 * 600 mm |
| Ketebalan papan: | 0,5-3,0 mm |
| Ketebalan tembaga: | 0,5-4oz |
| Ukuran bolongan minimal: | 0,8 mm |
| Jembar minimal: | 0,1 mm |
| Spasi minimal: | 0,12 mm |
| Ukuran pad minimal: | 10 mikron |
| Rampung lumahing: | HASL, OSP, ENIG |
| Wujud: | CNC, Punching, V-cut |
| peralatan: | Tester Universal |
| Flying Probe Open / Short Tester | |
| Mikroskop daya dhuwur | |
| Kit Testing Solderability | |
| Peel Strength tester | |
| High Volt Open & Short tester | |
| Cross Section Molding Kit Kanthi Polisher | |
| Kapasitas FPC | |
| Lapisan: | 1-8 lapisan |
| Ketebalan papan: | 0,05-0,5 mm |
| Ketebalan tembaga: | 0,5-3 OZ |
| Jembar minimal: | 0,075 mm |
| Spasi minimal: | 0,075 mm |
| Ukuran lubang in-through: | 0,2 mm |
| Ukuran lubang laser minimum: | 0,075 mm |
| Ukuran punching hole minimal: | 0,5 mm |
| Toleransi Soldermask: | +\-0,5 mm |
| Toleransi ukuran routing minimal: | +\-0,5 mm |
| Rampung lumahing: | HASL, LF HASL, Immersion Silver, Immersion Gold, Flash Gold, OSP |
| Wujud: | Punching, Laser, Cut |
| peralatan: | Tester Universal |
| Flying Probe Open / Short Tester | |
| Mikroskop daya dhuwur | |
| Kit Testing Solderability | |
| Peel Strength tester | |
| High Volt Open & Short tester | |
| Cross Section Molding Kit Kanthi Polisher | |
| Kapasitas kaku & fleksibel | |
| Lapisan: | 1-28 lapisan |
| Tipe bahan: | FR-4(Tg Dhuwur, Bebas Halogen, Frekuensi Dhuwur) PTFE, BT, Getek, Aluminium base，Tembaga dasar，KB, Nanya, Shengyi, ITEQ, ILM, Isola, Nelco, Rogers, Arlon |
| Ketebalan papan: | 6-240mil / 0,15-6,0mm |
| Ketebalan tembaga: | 210um (6oz) kanggo lapisan njero 210um (6oz) kanggo lapisan njaba |
| Min ukuran bor mekanik: | 0.2mm / 0.08" |
| Rasio aspek: | 2:1 |
| Ukuran panel maks: | Sigle sisih utawa pindho sisih: 500mm * 1200mm |
| Lapisan multilayer: 508mm X 610mm (20″ X 24″) | |
| Jembar garis / spasi min: | 0.076mm / 0.076mm (0.003″ / 0.003″)/ 3mil/3mil |
| Via jinis bolongan: | Buta / Dikubur / Dipasang (VOP, VIP…) |
| HDI / Mikrovia: | YA |
| Rampung lumahing: | HASL, LF HASL |
| Immersion Gold, Flash Emas, driji Emas | |
| Immersion Silver, Immersion Tin, OSP | |
| Plating Emas Selektif, ketebalan emas nganti 3um (120u") | |
| Carbon Print, Peelable S/M, ENEPIG | |
| Wujud: | CNC, Punching, V-cut |
| peralatan: | Tester Universal |
| Flying Probe Open / Short Tester | |
| Mikroskop daya dhuwur | |
| Kit Testing Solderability | |
| Peel Strength tester | |
| High Volt Open & Short tester | |
| Cross Section Molding Kit Kanthi Polisher | |
