Kapasitas Pangiriman
Kapasitas Dewan Kaku | |
Jumlah lapisan: | 1-42 Lapisan |
Bahan: | FR4 \ high tg fr4 \ timbal gratis material \ aluminium \ inci inti \ ptfe \ rogers |
Metu lapisan tebal: | 1-6oz |
Lapisan lapisan batih secara kekandelan: | 1-4oz |
Wilayah pangolahan maksimal: | 610 * 1100mm |
Penebalan papan minimal: | 2 lapisan 0.3mm (12mil) 4 lapisan 0.4mm (16mil) 6 lapisan 0,8mm (32mil) 8 lapisan 1.0mm (40mil) 10 lapisan 1.1mm (44mil) 12 lapisan 1.3mm (52mil) 14 lapisan 1,5mm (59mil) 16 lapisan 1.6mm (63mil) |
Lebar minimal: | 0,076mm (3mil) |
Papan minimal: | 0,076mm (3mil) |
Ukuran bolongan minimal (bolongan pungkasan): | 0.2mm |
Aspek aspek: | 10: 1 |
Ukuran Bolongan Holid: | 0.2-0.65mm |
Toleransi Pengeboran: | + - 0,05mm (2mil) |
Toleransi Pth: | Φ0.2-1,6mm + - 0.075mm (3mil) Φ1.6-6.3mm + - 0.1mm (4mil) |
Toleransi NPT: | Φ0.2-1,6mm + - 0,05mm (2mil) Φ1.6-6.3mm + - 0,05mm (2mil) |
Toleransi Dewan Rampung: | Kekandelan <0,8mm, toleransi: +/- 0,08mm |
0.8mm≤thickness≤6.5mm, toleransi +/- 10% | |
Jembatan Soldermask minimal: | 0,076mm (3mil) |
Twisting lan bending: | ≤0.75% min0.5% |
Raneg saka TG: | 130-215 ℃ |
Toleransi impedansi: | +/- 10%, min +/- 5% |
Perawatan permukaan:
| Hasl, Lf Hasl |
Gold Gold, Flash Emas, driji emas | |
Silver Silver, Tin, OSP | |
Plating Emas Selektif, kekandelan emas nganti 3um (120u ") | |
Cetak Karbon, pejabat S / M, Enepig | |
Kapasitas Dewan Aluminium | |
Jumlah lapisan: | Lapisan tunggal, lapisan dobel |
Ukuran Papan maksimal: | 1500 * 600mm |
Penebalan papan: | 0.5-3.0mm |
Kekandelan tembaga: | 0.5-4oz |
Ukuran bolongan minimal: | 0,8mm |
Lebar minimal: | 0.1mm |
Papan minimal: | 0.12mm |
Ukuran Pad PAD: | 10 micron |
Lumahing rampung: | Hasl, OSP, Enig |
Mbentuk: | Cnc, pukulan, v-ngethok |
Kesetaraan: | Tester Universal |
Teser Flying Open / Tester Short | |
Mikroskop daya dhuwur | |
Kit uji coba sing adol | |
Tester Kekuwatan Peel | |
Tester Vol Tinggi & Dhuwur Tester | |
Kit Molding Bagean Cross karo Polisher | |
Kapasitas FPC | |
Lapisan: | 1-8 Lapisan |
Penebalan papan: | 0,05-0.5mm |
Kekandelan tembaga: | 0.5-3oz |
Lebar minimal: | 0.075mm |
Papan minimal: | 0.075mm |
Ing lumantar Ukuran Bolongan: | 0.2mm |
Ukuran bolongan laser minimal: | 0.075mm |
Ukuran bolongan minimal minimal: | 0.5mm |
Soldermask Toleransi: | + - 0.5mm |
Toleransi dimensi minimal: | + - 0.5mm |
Lumahing rampung: | Hasl, LF HASL, Silver Immersion, Gold Gold, Flash Gold, OSP |
Mbentuk: | Punching, Laser, Motong |
Kesetaraan: | Tester Universal |
Teser Flying Open / Tester Short | |
Mikroskop daya dhuwur | |
Kit uji coba sing adol | |
Tester Kekuwatan Peel | |
Tester Vol Tinggi & Dhuwur Tester | |
Kit Molding Bagean Cross karo Polisher | |
Kapasitas & Flex Rigid | |
Lapisan: | 1-28 Lapisan |
Jinis Bahan: | Fr-4 (dhuwur, halogen gratis, frekuensi dhuwur) PTFE, BT, Getek, Base Aluminium, Base Tembaga, KB, Nanany, Shengyi, ITEQ, ILM, Isola, Nelco, Rogers, Arlon |
Penebalan papan: | 6-240mil / 0.15-6.0mm |
Kekandelan tembaga: | 210um (6oz) kanggo lapisan jero 210um (6oz) kanggo lapisan njaba |
Ukuran Pengeboran Mesin Min: | 0.2mm / 0.08 " |
Aspek aspek: | 2: 1 |
Ukuran panel Max: | Sisih sigle utawa ganda kaping pindho: 500mm * 1200mm |
Lapisan multilayer: 508mm x 610mm (20 "x 24") | |
Widget Min / Spasi Min: | 0.076mm / 0.076mm (0.003 "/ 0.003") / 3mil / 3mil |
Liwat jinis bolongan: | Buta / Dikubur / Plancokan (VOP, VIP ...) |
HDI / Microvia: | Ya |
Lumahing rampung: | Hasl, Lf Hasl |
Gold Gold, Flash Emas, driji emas | |
Silver Silver, Tin, OSP | |
Plating Emas Selektif, kekandelan emas nganti 3um (120u ") | |
Cetak Karbon, pejabat S / M, Enepig | |
Mbentuk: | Cnc, pukulan, v-ngethok |
Kesetaraan: | Tester Universal |
Teser Flying Open / Tester Short | |
Mikroskop daya dhuwur | |
Kit uji coba sing adol | |
Tester Kekuwatan Peel | |
Tester Vol Tinggi & Dhuwur Tester | |
Kit Molding Bagean Cross karo Polisher |